Introduction: Recently, Zhejiang Dinglong Weibao Precision Technology Co., Ltd. (“Dinglong Weibao”), a subsidiary of Changhong Technology’s semiconductor division, has stood out in the market dominated by international giants and successfully won the bid for a FOUP project from a leading domestic wafer fab. The exact quantity of products will be confirmed in future quarterly orders.

 

Dinglong Weibao’s independently developed and manufactured FOUP (Front Opening Unified Pod) products are used in the production process of 12-inch wafer fabs, serving as indispensable high-precision carrying and transportation tools in semiconductor manufacturing. The successful bid for this project signifies that the company’s FOUP product quality has been recognized by major domestic FAB manufacturers, qualifying it for mass production.

 

This bid marks a critical step in the development of Changhong Technology’s semiconductor division and represents an important milestone in expanding the company’s semiconductor consumables business. Currently, several other semiconductor consumable products from the company are undergoing testing at other FAB manufacturers. Taking this opportunity, the company will continue to strengthen technological innovation and breakthroughs, striving to achieve full localization of high-end wafer carriers as soon as possible. This will enable the company to provide more high-quality services to domestic customers, support the national semiconductor industry chain’s “independent and controllable” strategy, and create greater value for shareholders.